Volume 8 Issue 1
Cylindrical Microparticle Transport and Deposition from Electrokinetic Microflow in a 90 Degree Bend
Myoung Lae Cho,Boo-Yong Lee andSang Guan You
1Institute of Fluid Engineering, China Jiliang University, Hangzhou, China
2Institute of Fluid Engineering, Zhejiang University, Hangzhou, Zhejiang, China
*Author to whom correspondence should be addressed.
Abstract
Cylindrical microparticle transport and deposition from electrokinetic microflow in a 90 degree bend have been numerically simulated. Under the effect of dielectrohporetic force, gravity and stokes force, it’s found that microparticles with larger size deposit on the lower region of the bend’s outer wall. An exponential curve of deposition efficiency versus the product of stokes number and shape factor is fitted based on large number of numerical results.
Keywords: Deposition Efficiency; Dielectrophoresis; Cylindrical Particle